EMP111-Q5 updated: 04/24/2008 7.0 ? 9.0 ghz surface-mounted pa specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 1 of 3 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com may 2008 features ? 7.0 ? 9.0 ghz operating frequency range ? 27 dbm output power at 1db compression ? 16.0 db typical small signal gain ? -40dbc oimd3 @each tone pout 17dbm applications ? point-to-point and point-to-multipoint radio ? military radar systems caution! esd sensitive device. electrical characteristics (t a = 25 c, 50 ohm, vdd=7v, idq=400ma) symbol parameter/test conditions min typ max units f operating frequency range 7.0 9.0 ghz p1db output power at 1db gain compression 25.5 27.0 dbm gss small signal gain 14.0 16.0 db oimd3 output 3 rd order intermodulation distortion @ ? f=10mhz, each tone pout 17dbm -40 -37 dbc input rl input return loss -10 db output rl output return loss -5 db idss saturate drain current v ds =3v, v gs =0v 490 620 750 ma v dd power supply voltage 7 8 v rth thermal resistance 1 22 o c/w tb operating base plate temperature -35 +85 oc absolute maximum ratings for continuous operation 2,3 symbol characteristic continuous v ds drain to source voltage 8 v v gs gate to source voltage -4 v i dd drain current idss i gsf forward gate current 9ma p in input power @ 3db compression t ch channel temperature 150c t stg storage temperature -65/150c p t total power dissipation 5.2w 1. r th is mounting dependent. measured result when us ed with excelics recommended evaluation board. 2. operating the device beyond any of the above rating may result in permanent damage. 3. bias conditions must also satisfy the following equation v ds *i ds < (t ch ?t hs )/r th ; where t hs = ambient temperature
EMP111-Q5 updated: 04/24/2008 7.0 ? 9.0 ghz surface-mounted pa specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 2 of 3 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com may 2008 chip outline and pin assignment 0.1970.002 0.1970.002 0.164 0.049 max 0.1970.002 0 ref 0 ref 0.0120.002 0.034 0.016 0 ref 0.042 0.008 0 ref 11 6 0.0260.002 10 5 -q5 15 20 16 1 emp111 additional notes: 1) ground plane must be soldered to pcb rf ground 2) all dimensions are in inches 3) refer to excelics application not es on qfns for further guidelines 4) pin assignment: vd1 20 bottom view vg top view rfin 15 vg -q5 rfout 11 rfout 6 10 vd2 vd1 vd2 16 1 5 rfin emp111 pin assignment 1, 2, 4, 5 nc 3 rf in 6 v g 7, 8, 9, 10, 11, 12, 14, 15 nc 13 rf out 16 v d2 17, 18, 19 nc 20 v d1
EMP111-Q5 updated: 04/24/2008 7.0 ? 9.0 ghz surface-mounted pa specifications are subjec t to change without notice. excelics semiconductor, inc. 310 de guigne drive, sunnyvale, ca 94085 page 3 of 3 phone: 408-737-1711 fax: 408-737-1868 web: www.excelics.com may 2008 recommended circuit schematic: rf out nc nc nc nc nc 0.1uf 22uf nc nc nc nc v g rf in v g -q5 nc nc v d2 nc nc 0.1uf 22uf d nc v d1 nc d 22uf 0.1uf emp111 notes: 1) external bypass capacitors should be placed as close to the package as possible. 2) dual biasing sequence required: a. turn-on sequence: apply v g = -2.5v, followed by v d = 7v, lastly increase v g until required i dq b. turn-off sequence: turn off v d , followed by v g 3) demonstration board available upon request.
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